About TEI

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

TEI is sponsored by ACM SIGCHI.

PAST TEI CONFERENCES

Archive Location Acceptance Rate (Accepted/Submitted) Attendance Publicaions
TEI '18 Stockholm, Sweden 37/130 = 28% 256 Proceedings
TEI '17 Yokohama, Japan 63/222 = 28% 363 Proceedings
TEI '16 Eindhoven, NL 45/178 = 25% 332 Proceedings
TEI '15 Stanford, CA, USA 63/222 = 28% 363 Proceedings
TEI '14 Munich, DE 78/238 = 33% 317 Proceedings
TEI '13 Barcelona, ES 48/136 = 35% 205 Proceedings
TEI '12 Kingston, ON, CA 42/135 = 31% 209 Proceedings
TEI '11 Funchal, PT 65/203 = 32% 270 Proceedings
TEI '10 Cambridge, MA, USA 54/160 = 34% Proceedings
TEI '09 Regent, England, UK 70/160 = 44% Proceedings
TEI '08 Bonn, DE 46/85 = 54% Proceedings
TEI '07 Baton Rouge, LA, USA 50/93 = 54% Proceedings
Overall 553/1562 = 35%