{"id":70,"date":"2020-04-09T21:56:40","date_gmt":"2020-04-09T21:56:40","guid":{"rendered":"https:\/\/tei.acm.org\/2021\/?page_id=70"},"modified":"2021-02-05T09:11:19","modified_gmt":"2021-02-05T09:11:19","slug":"about-tei","status":"publish","type":"page","link":"https:\/\/tei.acm.org\/2021\/about-tei\/","title":{"rendered":"About TEI"},"content":{"rendered":"\n

About TEI<\/h1>\n\n\n\n

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.<\/p>\n\n\n\n

TEI is sponsored by ACM SIGCHI<\/a>, who have additional historical data on this conference series on their website<\/a>.<\/p>\n\n\n\n

TEI Steering Committee<\/strong><\/span><\/h3>\n\n\n\n

Albrecht Schmidt<\/strong>, LMU (Germany)
Ali Mazalek<\/strong>, Georgia Tech (USA) & Ryerson University (Canada)
Alissa Antle<\/strong>, Simon Fraser University (Canada)
Andreas Butz<\/strong>, LMU (Germany)
Audrey Girouard<\/strong>, Carleton University (Canada)
Bart Hengeveld<\/strong>, Eindhoven University of Technology (Netherlands)
Brygg Ullmer<\/strong>, Clemson University (USA)
Caroline Hummels<\/strong>, Eindhoven University of Technology (Netherlands)
Daniel Saakes<\/strong>, KAIST (Korea)
Elise van den Hoven<\/strong>, University of Technology Sydney (Australia) & TU\/e (Netherlands)
Ellen Yi-Luen Do<\/strong>, University of Colorado Boulder (USA) & National University of Singapore (Singapore)
Eva Hornecker<\/strong>, Bauhaus-Universit\u00e4t Weimar (Germany)
Hiroshi Ishii<\/strong>, MIT Media Lab (USA)
Jelle van Dijk<\/strong>, University of Twente (Netherlands)
Lian Loke<\/strong>, University of Sydney (Australia)
Luc Geurts<\/strong>, KU Leuven (Belgium)
Martin Kaltenbrunner<\/strong>, UFG (Austria)
Orit Shaer<\/strong>, Wellesley College (USA)
Rob Jacob<\/strong>, Tufts University (USA)
Ron Wakkary<\/strong>, Simon Fraser University (Canada) & TU\/e (Netherlands)
Saskia Bakker<\/strong>, Eindhoven University of Technology (Netherlands)
Sergi Jorda<\/strong>, UPF (Spain)
Stacey Kuznetsov<\/strong>, Arizona State University (USA)
Wendy Ju<\/strong>, Cornell Tech (USA)
Ylva Fernaeus<\/strong>, KTH (Sweden)<\/p>\n\n\n\n

Past TEI conferences<\/h2>\n\n\n\n
Archive<\/th>Location<\/th>Acceptance Rate<\/th>Attendance<\/th>Publications<\/th><\/tr>
TEI \u201921<\/a><\/td>Salzburg, Austria (online)<\/td>40\/136 = 29%<\/td><\/td><\/td><\/tr>
TEI \u201920<\/a><\/td>Sydney, Australia<\/td>37\/132 = 28%<\/td>146<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201919<\/a><\/td>Tempe, Arizona, USA<\/td>37\/110 = 34%<\/td>187<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201918<\/a><\/td>Stockholm, Sweden<\/td>37\/130 = 28%<\/td>256<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201917<\/a><\/td>Yokohama, Japan<\/td>41\/151 = 27%<\/td>246<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201916<\/a><\/td>Eindhoven, Netherlands<\/td>45\/178 = 25%<\/td>332<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201915<\/a><\/td>Stanford, CA, USA<\/td>63\/222 = 28%<\/td>363<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201914<\/a><\/td>Munich, DE<\/td>78\/238 = 33%<\/td>317<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201913<\/a><\/td>Barcelona, ES<\/td>48\/136 = 35%<\/td>205<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201912<\/a><\/td>Kingston, ON, CA<\/td>42\/135 = 31%<\/td>209<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201911<\/a><\/td>Funchal, PT<\/td>65\/203 = 32%<\/td>270<\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201910<\/a><\/td>Cambridge, MA, USA<\/td>54\/160 = 34%<\/td><\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201909<\/a><\/td>Cambridge, England, UK<\/td>70\/160 = 44%<\/td><\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201908<\/a><\/td>Bonn, DE<\/td>46\/85 = 54%<\/td><\/td>Proceedings<\/a><\/td><\/tr>
TEI \u201907<\/a><\/td>Baton Rouge, LA, USA<\/td>50\/93 = 54%<\/td><\/td>Proceedings<\/a><\/td><\/tr>
Overall<\/strong><\/td><\/td>753\/2269 = 33%<\/td><\/td><\/tr><\/tbody><\/table><\/figure>\n","protected":false},"excerpt":{"rendered":"

About TEI The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-70","page","type-page","status-publish","hentry"],"yoast_head":"\nAbout TEI – TEI 2021<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/tei.acm.org\/2021\/about-tei\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"About TEI – TEI 2021\" \/>\n<meta property=\"og:description\" content=\"About TEI The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. 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