About TEI

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.

TEI Steering Committee

  • Albrecht Schmidt, LMU (Germany)
  • Ali Mazalek, Georgia Tech (USA) & Ryerson University (Canada)
  • Alissa Antle, Simon Fraser University (Canada)
  • Andreas Butz, LMU (Germany)
  • Audrey Girouard, Carleton University (Canada)
  • Bart Hengeveld, Eindhoven University of Technology (Netherlands)
  • Brygg Ullmer, Clemson University (USA)
  • Caroline Hummels, Eindhoven University of Technology (Netherlands)
  • Daniel Saakes, KAIST (Korea)
  • Elise van den Hoven, University of Technology Sydney (Australia) & TU/e (Netherlands)
  • Ellen Yi-Luen Do, University of Colorado Boulder (USA) & National University of Singapore (Singapore)
  • Eva Hornecker, Bauhaus-Universität Weimar (Germany)
  • Hiroshi Ishii, MIT Media Lab (USA)
  • Jelle van Dijk, University of Twente (Netherlands)
  • Lian Loke, University of Sydney (Australia)
  • Luc Geurts, KU Leuven (Belgium)
  • Martin Kaltenbrunner, UFG (Austria)
  • Orit Shaer, Wellesley College (USA)
  • Rob Jacob, Tufts University (USA)
  • Ron Wakkary, Simon Fraser University (Canada) & TU/e (Netherlands)
  • Saskia Bakker, Philips (Netherlands)
  • Sergi Jorda, UPF (Spain)
  • Stacey Kuznetsov, Arizona State University (USA)
  • Wendy Ju, Cornell Tech (USA)
  • Ylva Fernaeus, KTH (Sweden)

Past TEI Conferences

Archive Location Acceptance Rate Attendance Publication
TEI ’21 Salzburg, Austria (online) 40/136 = 29%
TEI ’20 Sydney, Australia 37/132 = 28% 146 Proceedings
TEI ’19 Tempe, Arizona, USA 37/110 = 34% 187 Proceedings
TEI ’18 Stockholm, Sweden 37/130 = 28% 256 Proceedings
TEI ’17 Yokohama, Japan 41/151 = 27% 246 Proceedings
TEI ’16 Eindhoven, Netherlands 45/178 = 25% 332 Proceedings
TEI ’15 Stanford, CA, USA 63/222 = 28% 363 Proceedings
TEI ’14 Munich, DE 78/238 = 33% 317 Proceedings
TEI ’13 Barcelona, ES 48/136 = 35% 205 Proceedings
TEI ’12 Kingston, ON, CA 42/135 = 31% 209 Proceedings
TEI ’11 Funchal, PT 65/203 = 32% 270 Proceedings
TEI ’10 Cambridge, MA, USA 54/160 = 34% Proceedings
TEI ’09 Cambridge, England, UK 70/160 = 44% Proceedings
TEI ’08 Bonn, DE 46/85 = 54% Proceedings
TEI ’07 Baton Rouge, LA, USA 50/93 = 54% Proceedings
Overall 753/2269 = 33%