Tangible, Embedded, and Embodied Interaction (TEI) 2022 is a venue for cutting-edge research in interaction design, new technologies and smart materials, user experience, design research, and interactive art. TEI is 100% sponsored by ACM (Association for Computing Machinery) and one of the larger SIGCHI (Special Interest Group Computer Human Interaction) conferences.
TEI typically attracts an audience of 300 participants from academia, industry and government. TEI 2022 will be the sixteenth conference and the first TEI in Korea. We build upon a successful tradition of hosting SIGCHI conferences in Korea, such as Mobile HCI, ISS interactive spaces and surfaces and CHI.
The conference attracts leading thinkers from academia, industry and government, as well as talented early-career researchers and UX (User Experience) designers. Sponsorship is an effective strategy for promoting your organization with target transdisciplinary audiences across tangible interaction, HCI (Human Computer Interaction), material sciences, social sciences, and the arts.
TEI 2022 is offering four general levels of sponsorship (Platinum, Gold, Silver, and Bronze). Each package can be extended to adapt to your needs. For more information, please contact the Sponsorship Chair.
PLATINUM SPONSORSHIP: 5,000 USD (5,000,000 KRW)
In the form of Fund sponsorship or Goods sponsorship A branded company event as part of the conference program (reception, banquet, lunch, or coffee break) Your company profile listed on the TEI 2022 website 5 complimentary registrations for people from your company to attend the conference (reception and banquet included) Your company logo and URL listed as a Platinum sponsor in all conference announcements, on the advance program, and on the conference web page Your company’s contribution acknowledged from the podium at the opening and closing sessions of the conference Company giveaways included with the conference material for each attendee Larger demo booth(or two booths of 2mX3m) to showcase promotional material during all conference days You will have the opportunity to join the committee and keynote speakers for dinner
GOLD SPONSORSHIP: 3,000 USD (3,000,000 KRW)
In the form of Fund sponsorship or Goods sponsorship 3 complimentary registrations for people from your company to attend the conference (reception and banquet included) Your company logo and URL listed as a Gold sponsor in all conference announcements, on the advance program, and on the conference web page Your company’s contribution acknowledged from the podium at the opening and closing sessions of the conference Company giveaways included with the conference material for each attendee Demo booth to showcase promotional material during all conference days
SILVER SPONSORSHIP: 2,000 USD (2,000,000 KRW)
In the form of Fund sponsorship or Goods sponsorship 2 complimentary registrations for people from your company to attend the conference (reception and banquet included) Your company logo and URL listed as a Silver sponsor in all conference announcements, on the advance program, and on the conference web page Your company’s contribution acknowledged from the podium at the opening and closing sessions of the conference Company giveaways included with the conference material for each attendee Demo booth to showcase promotional material during all conference days
BRONZE SPONSORSHIP: 1,000 USD (1,000,000 KRW)
In the form of Fund sponsorship or Goods sponsorship 1 complimentary registration for someone from your company to attend the conference (reception and banquet included) Your company logo and URL listed as a Bronze sponsor in all conference announcements, on the advance program, and on the conference web page Company giveaways included with the conference material for each attendee You will have the opportunity to include giveaways with the conference material for each attendee Your company logo and URL listed as a Gold sponsor in all conference announcements, on the advance program, and on the conference web page Your company’s contribution acknowledged from the podium at the opening and closing sessions of the conference Company giveaways included with the conference material for each attendee Demo booth to showcase promotional material during all conference days
Sponsorship Application
Please send an application email to Jongmin Kim sponsorship@tei.acm.org