About TEI

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.

TEI Steering Committee

  • Ali Mazalek, Georgia Tech (USA) & Ryerson University (Canada)
  • Alissa Antle, Simon Fraser University (Canada)
  • Audrey Girouard, Carleton University (Canada)
  • Augusto Esteves, Interactive Technologies Institute, LARSyS Instituto Superior (Portugal)
  • Bart Hengeveld, Eindhoven University of Technology (Netherlands)
  • Brygg Ullmer, Clemson University (USA)
  • Caroline Hummels, Eindhoven University of Technology (Netherlands)
  • Daniel Saakes, KAIST (Korea)
  • Elise van den Hoven, University of Technology Sydney (Australia) & TU/e (Netherlands)
  • Ellen Yi-Luen Do, University of Colorado Boulder (USA) & National University of Singapore (Singapore)
  • Eva Hornecker, Bauhaus-Universität Weimar (Germany)
  • Hiroshi Ishii, MIT Media Lab (USA)
  • Jelle van Dijk, University of Twente (Netherlands)
  • Lian Loke, University of Sydney (Australia)
  • Luc Geurts, KU Leuven (Belgium)
  • Martin Kaltenbrunner, UFG (Austria)
  • Orit Shaer, Wellesley College (USA)
  • Paul Strohmeier, Max Planck Institute for Informatics (Germany)
  • Saskia Bakker, Philips (Netherlands)
  • Stacey Kuznetsov, Arizona State University (USA)
  • Ylva Fernaeus, KTH (Sweden)

Past TEI Conferences

ARCHIVELOCATIONACCEPTANCE RATEATTENDANCEPUBLICATION
TEI ’22Daejeon, South Korea (online)  Proceedings
TEI ’21Salzburg, Austria (online)40/136 = 29% Proceedings
TEI ’20Sydney, Australia37/132 = 28%146Proceedings
TEI ’19Tempe, Arizona, USA37/110 = 34%187Proceedings
TEI ’18Stockholm, Sweden37/130 = 28%256Proceedings
TEI ’17Yokohama, Japan41/151 = 27%246Proceedings
TEI ’16Eindhoven, Netherlands45/178 = 25%332Proceedings
TEI ’15Stanford, CA, USA63/222 = 28%363Proceedings
TEI ’14Munich, DE78/238 = 33%317Proceedings
TEI ’13Barcelona, ES48/136 = 35%205Proceedings
TEI ’12Kingston, ON, CA42/135 = 31%209Proceedings
TEI ’11Funchal, PT65/203 = 32%270Proceedings
TEI ’10Cambridge, MA, USA54/160 = 34% Proceedings
TEI ’09Cambridge, England, UK70/160 = 44% Proceedings
TEI ’08Bonn, DE46/85 = 54% Proceedings
TEI ’07Baton Rouge, LA, USA50/93 = 54% Proceedings
Overall 753/2269 = 33%  

CONFERENCE INFO

TEI’ 23

17th International Annual Conference on Tangible, Embedded, and Embodied Interaction

26 February – 1 March 2023 in Warsaw, Poland in University of Warsaw Library and Copernicus Science Centre

PARTNERS

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