1.0TEI 23https://tei.acm.org/2023adminhttps://tei.acm.org/2023/author/admin/rich600338<blockquote class="wp-embedded-content" data-secret="YrUuGhOzj9"><a href="https://tei.acm.org/2023/">Home</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://tei.acm.org/2023/embed/#?secret=YrUuGhOzj9" width="600" height="338" title="“Home” — TEI 23" data-secret="YrUuGhOzj9" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript"> /* <![CDATA[ */ /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://tei.acm.org/2023/wp-includes/js/wp-embed.min.js /* ]]> */ </script> https://tei.acm.org/2023/wp-content/uploads/2022/05/Frame-1-1.png1183680Welcome to TEI 2023! Welcome to The 2013 ACM International Conference on Tangible, Embedded and Embodied Interaction. This year, TEI will take place in Warsaw Poland. TEI 2023 will be an in-person event with remote attendance possibilities. We have an exiting programme for you including papers, pictorials, works in progress, arts, studios and student design […]