about tei

tangible, embedded and embodied interaction

TEI '27 is the 21st annual conference presenting the latest research and innovations in tangible, embedded, and embodied interaction.

The work presented at TEI has a strong focus on the physical side of interaction design, encompassing everything from haptic controllers and interactive surfaces to wearable computing and smart materials. Over the last two decades, the ACM TEI conference has grown into a major multidisciplinary venue for researchers, practitioners, and artists alike.

TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.

conference scope

TEI brings together diverse disciplines including computer science, engineering, product design, interaction design, and the arts. We invite contributions that explore the intersection of the physical and the digital, with a specific interest in sensory experiences, digital fabrication, and human-robot interaction.

tei steering committee

Ali Mazalek, Toronto Metropolitan University (Canada)
Alissa Antle, Simon Fraser University (Canada)
Audrey Girouard, Carleton University (Canada)
Augusto Esteves, ITI / LARSyS, Universidade de Lisboa (Portugal)
Bart Hengeveld, Eindhoven University of Technology (Netherlands)
Brygg Ullmer, Clemson University (USA)
Caroline Hummels, Eindhoven University of Technology (Netherlands)
Daniel Saakes, KAIST (Korea)
Elise van den Hoven, University of Technology Sydney (Australia)
Ellen Yi-Luen Do, University of Colorado Boulder (USA)
Eva Hornecker, Bauhaus-Universität Weimar (Germany)
Hiroshi Ishii, MIT Media Lab (USA)
Jelle van Dijk, University of Twente (Netherlands)
Lian Loke, University of Sydney (Australia)
Lucca Geurts, KU Leuven (Belgium)
Martin Kaltenbrunner, UFG (Austria)
Orit Shaer, Wellesley College (USA)
Paul Strohmeier, Max Planck Institute for Informatics (Germany)
Robert Jacob, Tufts University (USA)
Sara Nabil, Queen's University (Canada)
Stacey Kuznetsov, Arizona State University (USA)
Trevor Hogan, Munster Technological University (Ireland)
Ylva Fernaeus, Umeå University and KTH (Sweden)

past tei conferences

Archive Location Acceptance Rate (Papers) Acceptance Rate (Pictorials) Attendance Publication
TEI'26 Chicago, USA 42/181 = 23% 15/73 = 20.6% 320 Proceedings
TEI'25 Bordeaux, France 35/141 = 24.8% 19/72 = 26% 253 Proceedings
TEI'24 Cork, Ireland 37/144 = 25.7% 19/72 = 26.4% 220 Proceedings
TEI'23 Warsaw, Poland 20/89 = 22.5% 16/59 = 27.1% 150 Proceedings
TEI'22 Daejeon, South Korea (online) 27/115 = 24% 16/47 = 34% — Proceedings
TEI'21 Salzburg, Austria (online) 40/136 = 29% 15/55 = 27.3% 350 Proceedings
TEI'20 Sydney, Australia 37/132 = 28% 12/38 = 31.6% 146 Proceedings
TEI'19 Tempe, Arizona, USA 36/110 = 33% — 187 Proceedings
TEI'18 Stockholm, Sweden 37/130 = 28% — 256 Proceedings
TEI'17 Yokohama, Japan 41/151 = 27% — 246 Proceedings
TEI'16 Eindhoven, Netherlands 45/178 = 25% — 332 Proceedings
TEI'15 Stanford, CA, USA 63/222 = 28% — 363 Proceedings
TEI'14 Munich, DE 46/172 = 27% — 317 Proceedings
TEI'13 Barcelona, ES 48/136 = 35% — 205 Proceedings
TEI'12 Kingston, ON, CA 42/135 = 31% — 209 Proceedings
TEI'11 Funchal, PT 65/203 = 32% — 270 Proceedings
TEI'10 Cambridge, MA, USA 54/160 = 34% — — Proceedings
TEI'09 Cambridge, England, UK 70/160 = 44% — — Proceedings
TEI'08 Bonn, DE 46/85 = 54% — 140 Proceedings
TEI'07 Baton Rouge, LA, USA 50/93 = 54% — — Proceedings