About TEI
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.
TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.
TEI Steering Committee
- Ali Mazalek, Toronto Metropolitan University (Canada)
- Alissa Antle, Simon Fraser University (Canada)
- Audrey Girouard, Carleton University (Canada)
- Augusto Esteves, ITI / LARSyS, University of Lisbon (Portugal)
- Bart Hengeveld, Eindhoven University of Technology (Netherlands)
- Brygg Ullmer, Clemson University (USA)
- Caroline Hummels, Eindhoven University of Technology (Netherlands)
- Daniel Saakes, KAIST (Korea)
- Elise van den Hoven, University of Technology Sydney (Australia)
- Ellen Yi-Luen Do, University of Colorado Boulder (USA)
- Eva Hornecker, Bauhaus-Universität Weimar (Germany)
- Hiroshi Ishii, MIT Media Lab (USA)
- Jelle van Dijk, University of Twente (Netherlands)
- Lian Loke, University of Sydney (Australia)
- Lucca Geurts, KU Leuven (Belgium)
- Martin Kaltenbrunner, UFG (Austria)
- Orit Shaer, Wellesley College (USA)
- Paul Strohmeier, Max Planck Institute for Informatics (Germany)
- Robert Jacob, Tufts University (USA)
- Sara Nabil, Queen's University (Canada)
- Stacey Kuznetsov, Arizona State University (USA)
- Trevor Hogan, Munster Technological University (Ireland)
- Ylva Fernaeus, Umeå University and KTH (Sweden)
Past TEI Conferences
Please also find statistics from the past 20 years of TEI archival data, compiled by the General Chair of TEI 2026:https://axlab-uofc.github.io/20th-tei-archive/
| Archive | Location | Acceptance Rate (Papers) | Acceptance Rate (Pictorials) | Attendance | Publication |
|---|---|---|---|---|---|
| TEI'26 | Chicago, United States | 42/181=23.2% | 15/73=20.5% | 326 | Proceedings |
| TEI'25 | Bordeaux, France | 35/141=24.8% | 19/72=26% | 253 | Proceedings |
| TEI'24 | Cork, Ireland | 37/144 = 25.7% | 19/72 = 26.4% | 220 | Proceedings |
| TEI'23 | Warsaw, Poland | 20/89 = 22.5% | 16/59 = 27.1% | 150 | Proceedings |
| TEI'22 | Daejeon, South Korea (online) | 27/115 = 24% | 16/47 = 34% | — | Proceedings |
| TEI'21 | Salzburg, Austria (online) | 40/136 = 29% | 15/55=27.3% | 350 | Proceedings |
| TEI'20 | Sydney, Australia | 37/132 = 28% | 12/38=31.6% | 146 | Proceedings |
| TEI'19 | Tempe, Arizona, USA | 36/110 = 33% | — | 187 | Proceedings |
| TEI'18 | Stockholm, Sweden | 37/130 = 28% | — | 256 | Proceedings |
| TEI'17 | Yokohama, Japan | 41/151 = 27% | — | 246 | Proceedings |
| TEI'16 | Eindhoven, Netherlands | 45/178 = 25% | — | 332 | Proceedings |
| TEI'15 | Stanford, CA, USA | 63/222 = 28% | — | 363 | Proceedings |
| TEI'14 | Munich, DE | 46/172 = 27% | — | 317 | Proceedings |
| TEI'13 | Barcelona, ES | 48/136 = 35% | — | 205 | Proceedings |
| TEI'12 | Kingston, ON, CA | 42/135 = 31% | — | 209 | Proceedings |
| TEI'11 | Funchal, PT | 65/203 = 32% | — | 270 | Proceedings |
| TEI'10 | Cambridge, MA, USA | 54/160 = 34% | — | — | Proceedings |
| TEI'09 | Cambridge, England, UK | 70/160 = 44% | — | — | Proceedings |
| TEI'08 | Bonn, DE | 46/85 = 54% | — | 140 | Proceedings |
| TEI'07 | Baton Rouge, LA, USA | 50/93 = 54% | — | — | Proceedings |