The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.
TEI is sponsored by ACM SIGCHI.
PAST TEI CONFERENCES
| Archive | Location | Acceptance Rate (Accepted/Submitted) | Attendance | Publicaions |
|---|---|---|---|---|
| TEI '17 | Yokohama, Japan | 41/151 = 27% | 246 | Proceedings |
| TEI '16 | Eindhoven, Netherlands | 45/178 = 25% | 332 | Proceedings |
| TEI '15 | Stanford, CA, USA | 63/222 = 28% | 363 | Proceedings |
| TEI '14 | Munich, DE | 78/238 = 33% | 317 | Proceedings |
| TEI '13 | Barcelona, ES | 48/136 = 35% | 205 | Proceedings |
| TEI '12 | Kingston, ON, CA | 42/135 = 31% | 209 | Proceedings |
| TEI '11 | Funchal, PT | 65/203 = 32% | 270 | Proceedings |
| TEI '10 | Cambridge, MA, USA | 54/160 = 34% | Proceedings | |
| TEI '09 | Regent, England, UK | 70/160 = 44% | Proceedings | |
| TEI '08 | Bonn, DE | 46/85 = 54% | Proceedings | |
| TEI '07 | Baton Rouge, LA, USA | 50/93 = 54% | Proceedings | |
| Overall | 516/1432 = 36% |