August 8, 2018 12pm PST

Paper submission deadline

August 29, 2018 12pm PST

Studio proposals deadline

October 24, 2018

Paper and Studio notification

November 7, 12pm PST

Arts Track submission deadline

November 9, 2018 12pm PST

Graduate Student Consortium submission deadline

November 14, 2018

Work in Progress submission deadline

November 20, 2018

Camera-ready deadline for Papers and Studio proposals

November 26, 2018 12pm PST

Student Design Challenge submission deadline

December 6, 2018

Arts Track and Graduate Student Consortium notification

December 14, 2018

Student Design Challenge notification

January 1st, 2019 12pm PST

SV applications deadline

January 9, 2019

Camera-ready deadline for Arts Track, Work in Progress, Student Design Challenge, and Graduate Student Consortium

December 12, 2018

Work in Progress notification of acceptance

January 25th, 2019

SV notification of acceptance

March 16, 2019 (Saturday)

SV orientation session

March 17, 2019 (Sunday)

Studios and Graduate Student Consortium meeting at TEI 2019

March 18-20, 2019 (Monday-Wednesday)

TEI 2019 Conference

Welcome to TEI 2019

TEI 2019 is the 13th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 17th to 20th March, 2019 in Tempe, Arizona, USA.

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

Theme: Hybrid Materials

Over the past few years, TEI research has increasingly embraced hybridity, whether through material explorations of composites such as bioelectronic, on-body, or active materials, or theoretical inquiries into socio-technical systems as hybrid assemblies. Not confined to a single approach, we have seen advancements in new materials—such as conductive and thermochromic inks, OLEDs, biosensors, or bioelectronics—which have helped to embed computing in the physical world. Simultaneously, comparisons between tangible computing and crafting traditions—such as crocheting or weaving—have served to destabilize assumptions about ‘low’ and ‘high’ technologies, the cultures that surround them, and even which communities have been able to participate in the discussion. These hybrid, materially-oriented approaches are radically changing our understanding of what tangible interaction looks and feels like. The theme of Hybrid Materials will continue to catalyze this exciting trend of tangible interaction research at the intersection of social, technical, biological, and artistic systems.

Venue: Tempe, Arizona

TEI 2019 will be held in Tempe, Arizona, a vibrant and growing Sonoran desert city. The main venue, the Tempe Mission Palms, is walking distance to the Arizona State University Campus and in the heart of Tempe shops, bars, and galleries. The conference rooms, AV services, catering, palm courtyard, and rooftop pool reception deck will offer a flexible meeting space for academic and social gatherings during the conference. In addition, TEI 2019 will host a performance program at the Tempe Center for the Arts (TCA) to showcase selected work from the Arts Track. Overlooking the Tempe Town Lake, the TCA includes a beautiful reception area and a 600-seat performance hall to accommodate a range of performances and interactive experiences centered around the conference theme.