TEI 2018 is the 12th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 18th to 21st March 2018 in Stockholm, Sweden.
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
TEI is sponsored by ACM SIGCHI.
Past TEI Conferences
| Archive | Location | Acceptance Rate (Accepted/Submitted) |
Attendance | Publications |
|---|---|---|---|---|
| TEI ’17 | Yokohama, Japan | 63/222 = 28% | 363 | Proceedings |
| TEI ’16 | Stanford, CA, USA | 45/178 = 25% | 332 | Proceedings |
| TEI ’15 | Stanford, CA, USA | 63/222 = 28% | 363 | Proceedings |
| TEI ’14 | Munich, DE | 78/238 = 33% | 317 | Proceedings |
| TEI ’13 | Barcelona, ES | 48/136 = 35% | 205 | Proceedings |
| TEI ’12 | Kingston, ON, CA | 42/135 = 31% | 209 | Proceedings |
| TEI ’11 | Funchal, PT | 65/203 = 32% | 270 | Proceedings |
| TEI ’10 | Cambridge, MA, USA | 54/160 = 34% | Proceedings | |
| TEI ’09 | Regent, England, UK | 70/160 = 44% | Proceedings | |
| TEI ’08 | Bonn, DE | 46/85 = 54% | Proceedings | |
| TEI ’07 | Baton Rouge, LA, USA | 50/93 = 54% | Proceedings | |
| Overall | 516/1432 = 36% |