About TEI

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.

The bidding process for organising the 2022 edition is now open. Please check the dedicated page for more info on how to apply for organising TEI 2022.

Past TEI conferences

ArchiveLocationAcceptance Rate (Accepted/Submitted)AttendancePublications
TEI ’21Salzburg, Austria
TEI ’20Sydney, Australia37/124 = 28%146Proceedings
TEI ’19Tempe, Arizona, USA37/110 = 34%187Proceedings
TEI ’18Stockholm, Sweden37/130 = 28%254Proceedings
TEI ’17Yokohama, Japan41/151 = 27%246Proceedings
TEI ’16Eindhoven, Netherlands45/178 = 25%332Proceedings
TEI ’15Stanford, CA, USA63/222 = 28%363Proceedings
TEI ’14Munich, DE78/238 = 33%317Proceedings
TEI ’13Barcelona, ES48/136 = 35%205Proceedings
TEI ’12Kingston, ON, CA42/135 = 31%209Proceedings
TEI ’11Funchal, PT65/203 = 32%270Proceedings
TEI ’10Cambridge, MA, USA54/160 = 34%Proceedings
TEI ’09Regent, England, UK70/160 = 44%Proceedings
TEI ’08Bonn, DE46/85 = 54%Proceedings
TEI ’07Baton Rouge, LA, USA50/93 = 54%Proceedings
Overall681/2059 = 33%