About TEI

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.

The bidding process for organising the 2022 edition is now open. Please check the dedicated page for more info on how to apply for organising TEI 2022.

Past TEI conferences

Archive Location Acceptance Rate (Accepted/Submitted) Attendance Publications
TEI ’19 Tempe, Arizona, USA 37/110 = 34% 187 Proceedings
TEI ’18 Stockholm, Sweden 37/130 = 28% 254 Proceedings
TEI ’17 Yokohama, Japan 41/151 = 27% 246 Proceedings
TEI ’16 Eindhoven, Netherlands 45/178 = 25% 332 Proceedings
TEI ’15 Stanford, CA, USA 63/222 = 28% 363 Proceedings
TEI ’14 Munich, DE 78/238 = 33% 317 Proceedings
TEI ’13 Barcelona, ES 48/136 = 35% 205 Proceedings
TEI ’12 Kingston, ON, CA 42/135 = 31% 209 Proceedings
TEI ’11 Funchal, PT 65/203 = 32% 270 Proceedings
TEI ’10 Cambridge, MA, USA 54/160 = 34% Proceedings
TEI ’09 Regent, England, UK 70/160 = 44% Proceedings
TEI ’08 Bonn, DE 46/85 = 54% Proceedings
TEI ’07 Baton Rouge, LA, USA 50/93 = 54% Proceedings
Overall 644/1935 = 33%