About TEI

About TEI

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.

TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.

TEI Steering Committee

Albrecht Schmidt, LMU (Germany)
Ali Mazalek, Georgia Tech (USA) & Ryerson University (Canada)
Alissa Antle, Simon Fraser University (Canada)
Andreas Butz, LMU (Germany)
Audrey Girouard, Carleton University (Canada)
Bart Hengeveld, Eindhoven University of Technology (Netherlands)
Brygg Ullmer, Clemson University (USA)
Caroline Hummels, Eindhoven University of Technology (Netherlands)
Daniel Saakes, KAIST (Korea)
Elise van den Hoven, University of Technology Sydney (Australia) & TU/e (Netherlands)
Ellen Yi-Luen Do, University of Colorado Boulder (USA) & National University of Singapore (Singapore)
Eva Hornecker, Bauhaus-Universität Weimar (Germany)
Hiroshi Ishii, MIT Media Lab (USA)
Jelle van Dijk, University of Twente (Netherlands)
Lian Loke, University of Sydney (Australia)
Luc Geurts, KU Leuven (Belgium)
Martin Kaltenbrunner, UFG (Austria)
Orit Shaer, Wellesley College (USA)
Rob Jacob, Tufts University (USA)
Ron Wakkary, Simon Fraser University (Canada) & TU/e (Netherlands)
Saskia Bakker, Eindhoven University of Technology (Netherlands)
Sergi Jorda, UPF (Spain)
Stacey Kuznetsov, Arizona State University (USA)
Wendy Ju, Cornell Tech (USA)
Ylva Fernaeus, KTH (Sweden)

Past TEI conferences

ArchiveLocationAcceptance RateAttendancePublications
TEI ’21Salzburg, Austria
TEI ’20Sydney, Australia37/124 = 28%146Proceedings
TEI ’19Tempe, Arizona, USA37/110 = 34%187Proceedings
TEI ’18Stockholm, Sweden37/130 = 28%254Proceedings
TEI ’17Yokohama, Japan41/151 = 27%246Proceedings
TEI ’16Eindhoven, Netherlands45/178 = 25%332Proceedings
TEI ’15Stanford, CA, USA63/222 = 28%363Proceedings
TEI ’14Munich, DE78/238 = 33%317Proceedings
TEI ’13Barcelona, ES48/136 = 35%205Proceedings
TEI ’12Kingston, ON, CA42/135 = 31%209Proceedings
TEI ’11Funchal, PT65/203 = 32%270Proceedings
TEI ’10Cambridge, MA, USA54/160 = 34%Proceedings
TEI ’09Regent, England, UK70/160 = 44%Proceedings
TEI ’08Bonn, DE46/85 = 54%Proceedings
TEI ’07Baton Rouge, LA, USA50/93 = 54%Proceedings
Overall681/2059 = 33%