20-23 March 2017 Yokohama, Japan

TEI 2017

11th International Conference on Tangible, Embedded and Embodied Interactions.
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About TEI 2017

TEI 2017 is the 11th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 20th to 23th March 2017 hosted at Keio University in Yokohama, Japan.

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.

TEI is sponsored by ACM SIGCHI, in collaboration with Keio University Graduate School of Media Design, known as Keio Media Design or KMD.

Theme
Scifi :: Reality

Recall your past to Grasp the Future

The 11th TEI conference one year after the anniversary should set an outlook about the future directions of the community and the research. Therefore, we feel it is significant that the conference is hosted in Asia. Let’s create and experience the future together at TEI 2017. Related to past and future there is a fitting Japanese pro-verb: 温故知新 (On-ko-chi-shin). It means “you need to recall the past to understand the future” in English. We modified it slightly, as a tagline for our theme: ”recall your past to grasp the future”. More than most other academic venues in the interaction area, the TEI community understands that our mind is embodied, so to design the future we need to grasp it.

We will be actively searching for contributions and experiences that touch our future lifes, wellbeing productivity etc.

Keio University
  • 4-1-1, Hiyoshi, Kohoku-ku, Yokohama-city, Japan, 223-8526
  • contact [at] tei.acm.org