About TEI
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances.
TEI is sponsored by ACM SIGCHI, who have additional historical data on this conference series on their website.
TEI Steering Committee
- Ali Mazalek, Toronto Metropolitan University (Canada)
- Alissa Antle, Simon Fraser University (Canada)
- Audrey Girouard, Carleton University (Canada)
- Augusto Esteves, ITI / LARSyS, University of Lisbon (Portugal)
- Bart Hengeveld, Eindhoven University of Technology (Netherlands)
- Brygg Ullmer, Clemson University (USA)
- Caroline Hummels, Eindhoven University of Technology (Netherlands)
- Daniel Saakes, KAIST (Korea)
- Elise van den Hoven, University of Technology Sydney (Australia)
- Ellen Yi-Luen Do, University of Colorado Boulder (USA)
- Eva Hornecker, Bauhaus-Universität Weimar (Germany)
- Hiroshi Ishii, MIT Media Lab (USA)
- Jelle van Dijk, University of Twente (Netherlands)
- Lian Loke, University of Sydney (Australia)
- Lucca Geurts, KU Leuven (Belgium)
- Martin Kaltenbrunner, UFG (Austria)
- Orit Shaer, Wellesley College (USA)
- Paul Strohmeier, Max Planck Institute for Informatics (Germany)
- Robert Jacob, Tufts University (USA)
- Sara Nabil, Queen's University (Canada)
- Stacey Kuznetsov, Arizona State University (USA)
- Trevor Hogan, Munster Technological University (Ireland)
- Ylva Fernaeus, Umeå University and KTH (Sweden)
Past TEI Conferences
| Archive | Location | Acceptance Rate | Attendance | Publication |
|---|---|---|---|---|
| TEI'25 | Bordeaux, France | |||
| TEI'24 | Cork, Ireland | 37/144=25.7% | 220 | Proceedings |
| TEI'23 | Warsaw, Poland | 20/89=22.5% | 150 | Proceedings |
| TEI'22 | Daejeon, South Korea (online) | 27/115 = 24% | Proceedings | |
| TEI'21 | Salzburg, Austria (online) | 40/136 = 29% | 350 | Proceedings |
| TEI'20 | Sydney, Australia | 37/132 = 28% | 146 | Proceedings |
| TEI'19 | Tempe, Arizona, USA | 36/110 = 33% | 187 | Proceedings |
| TEI'18 | Stockholm, Sweden | 37/130 = 28% | 256 | Proceedings |
| TEI'17 | Yokohama, Japan | 41/151 = 27% | 246 | Proceedings |
| TEI'16 | Eindhoven, Netherlands | 45/178 = 25% | 332 | Proceedings |
| TEI'15 | Stanford, CA, USA | 63/222 = 28% | 363 | Proceedings |
| TEI'14 | Munich, DE | 46/172 = 27% | 317 | Proceedings |
| TEI'13 | Barcelona, ES | 48/136 = 35% | 205 | Proceedings |
| TEI'12 | Kingston, ON, CA | 42/135 = 31% | 209 | Proceedings |
| TEI'11 | Funchal, PT | 65/203 = 32% | 270 | Proceedings |
| TEI'10 | Cambridge, MA, USA | 54/160 = 34% | Proceedings | |
| TEI'09 | Cambridge, England, UK | 70/160 = 44% | Proceedings | |
| TEI'08 | Bonn, DE | 46/85 = 54% | 140 | Proceedings |
| TEI'07 | Baton Rouge, LA, USA | 50/93 = 54% | Proceedings |